Storage/Thermal Sim Methodology: Difference between revisions
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Welcome to the OCP '''Thermal Sim Methodology''' workstream page | Welcome to the OCP '''Thermal Sim Methodology''' workstream page | ||
The Thermal Sim Methodology will | The Thermal Sim Methodology will standardize aspects of the thermal characterization of drives in systems, defining common methods, metrics, and assumptions. The goal of the methodology is to enable system and device vendors to better target new form factors such that the form factors meet the thermal requirements of the systems for which the form factors are being defined. | ||
==Links== | ==Links== | ||
| Line 15: | Line 15: | ||
:- [mailto:dave.landsman@wdc.com Dave Landsman] (Western Digital) | :- [mailto:dave.landsman@wdc.com Dave Landsman] (Western Digital) | ||
:- [mailto:amber.huffman@ocproject.net Amber Huffman] (Google) | |||
==Documents== | ==Documents== | ||
Important Note: Please do not submit confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. See [http://www.opencompute.org/about/ocp-policies/ OCP Policies]. If you have any questions please contact OCP. | Important Note: Please do not submit confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. See [http://www.opencompute.org/about/ocp-policies/ OCP Policies]. If you have any questions please contact OCP. | ||
{| class="wikitable" | {| class="wikitable" | ||
| Line 32: | Line 28: | ||
! Company | ! Company | ||
! Date Presented | ! Date Presented | ||
|- | |||
| [https://docs.google.com/document/d/1qflj3kHEYXb0PCi3dP2AjS76l_Vi0gZ0QljM94HLTBI/edit?usp=sharing OCP Thermal Modeling Methodology 2020.11.07 (Draft)] | |||
| David Wright & Paul Gwinn | |||
| Western Digital & Intel | |||
| 2020-11-05 | |||
|- | |||
| [https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.ssl.cf1.rackcdn.com/images/026f92ca984b83fe8859db3f97e8e40829c15381.pdf Initial EDSFF Thermal] | |||
| | |||
| NGD Systems | |||
| 2020-10-28 | |||
|- | |||
| [http://files.opencompute.org/oc/public.php?service=files&t=7012cffb68ba9292eb54b5bb51ec598c&download E1.S Thermals Data] | |||
| Dave Landsman & David Wright | |||
| Western Digital | |||
| 2019-10-28 | |||
|- | |||
| [http://files.opencompute.org/oc/public.php?service=files&t=d70dfaa48f298b3680a65e83eb293447&download Datacenter SSD FF Thermal Issues] | |||
| Jason Adrian | |||
| Microsoft | |||
| 2019-10-28 | |||
|- | |||
| [http://files.opencompute.org/oc/public.php?service=files&t=29c871d95a76534439ff8c44d923932e&download E1.S Power Methodology] | |||
| Brandon Gary | |||
| Microsoft | |||
| 2019-12-12 | |||
|- | |||
| [http://files.opencompute.org/oc/public.php?service=files&t=6c23bd27be247cf239f76576f7f29a86&download EDSFF Thermal Methodology E1.S FF Width] | |||
| Paul Gwin | |||
| Intel | |||
| 2020-01-16 | |||
|- | |- | ||
| [http://files.opencompute.org/oc/public.php?service=files&t=976372ab6b04df5b24ee68b9509cc85d&download Thermal Workgroup Goals] | | [http://files.opencompute.org/oc/public.php?service=files&t=976372ab6b04df5b24ee68b9509cc85d&download Thermal Workgroup Goals] | ||
| Line 38: | Line 64: | ||
| 2020-02-13 | | 2020-02-13 | ||
|- | |- | ||
| [http://files.opencompute.org/oc/public.php?service=files&t=2d4847fd8fc6ee1cbd48221adf29e7ed&download SSD Thermal Simulation Standardization for OCP Summit] | |||
| [http://files.opencompute.org/oc/public.php?service=files&t=2d4847fd8fc6ee1cbd48221adf29e7ed&download | |||
| Paul Gwin, Dave Landsman | | Paul Gwin, Dave Landsman | ||
| Intel | | Intel-Microsoft-WDC | ||
| 2020-05-14 | | 2020-05-14 | ||
|- | |- | ||
| [http://files.opencompute.org/oc/public.php?service=files&t= | | [http://files.opencompute.org/oc/public.php?service=files&t=828242f79f96acab22bc31c190600273&download E3 Thermal Methodology Slides] | ||
| Bill Lynn | | Bill Lynn | ||
| DellEMC | | DellEMC | ||
| Line 57: | Line 78: | ||
| DellEMC | | DellEMC | ||
| 2020-07-23 | | 2020-07-23 | ||
|- | |||
| [http://files.opencompute.org/oc/public.php?service=files&t=b915c9e26360fcfed68ffbb59f54564b&download Thermal Methodology Revisit Discussion] | |||
| Paul Gwin | |||
| Intel | |||
| 2020-07-30 | |||
|} | |} | ||
==Meetings== | ==Meetings== | ||
==Recordings from Past Calls== | ==Recordings from Past Calls== | ||
:- [https://www.youtube.com/watch?v=ZIayR44gwdA November 19th, 2020] | |||
:- [https://www.youtube.com/watch?v=7PXcGPkOGJI November 5th, 2020] | |||
:- [https://www.youtube.com/watch?v=89aEL1_PwEo August 6th, 2020] | |||
:- [https://www.youtube.com/watch?v=dhLTnFGKCus July 30th, 2020] | |||
:- [https://www.youtube.com/watch?v=JgNR1iP_Gc8 July 23rd, 2020] | :- [https://www.youtube.com/watch?v=JgNR1iP_Gc8 July 23rd, 2020] | ||
:- [https://www.youtube.com/watch?v=K8TW-LMCDCI July 16th, 2020] | :- [https://www.youtube.com/watch?v=K8TW-LMCDCI July 16th, 2020] | ||
Latest revision as of 01:11, 13 April 2022
WELCOME[edit]
Welcome to the OCP Thermal Sim Methodology workstream page
The Thermal Sim Methodology will standardize aspects of the thermal characterization of drives in systems, defining common methods, metrics, and assumptions. The goal of the methodology is to enable system and device vendors to better target new form factors such that the form factors meet the thermal requirements of the systems for which the form factors are being defined.
Links[edit]
Leads[edit]
- - Dave Landsman (Western Digital)
- - Amber Huffman (Google)
Documents[edit]
Important Note: Please do not submit confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. See OCP Policies. If you have any questions please contact OCP.
| Topic | Speaker | Company | Date Presented |
|---|---|---|---|
| OCP Thermal Modeling Methodology 2020.11.07 (Draft) | David Wright & Paul Gwinn | Western Digital & Intel | 2020-11-05 |
| Initial EDSFF Thermal | NGD Systems | 2020-10-28 | |
| E1.S Thermals Data | Dave Landsman & David Wright | Western Digital | 2019-10-28 |
| Datacenter SSD FF Thermal Issues | Jason Adrian | Microsoft | 2019-10-28 |
| E1.S Power Methodology | Brandon Gary | Microsoft | 2019-12-12 |
| EDSFF Thermal Methodology E1.S FF Width | Paul Gwin | Intel | 2020-01-16 |
| Thermal Workgroup Goals | Paul Gwin | Intel | 2020-02-13 |
| SSD Thermal Simulation Standardization for OCP Summit | Paul Gwin, Dave Landsman | Intel-Microsoft-WDC | 2020-05-14 |
| E3 Thermal Methodology Slides | Bill Lynn | DellEMC | 2020-07-09 |
| EDSFF Thermal Sim Spec Outline Doc v1 | Bill Lynn | DellEMC | 2020-07-23 |
| Thermal Methodology Revisit Discussion | Paul Gwin | Intel | 2020-07-30 |
Meetings[edit]
Recordings from Past Calls[edit]
- - November 19th, 2020
- - November 5th, 2020
- - August 6th, 2020
- - July 30th, 2020
- - July 23rd, 2020
- - July 16th, 2020
- - June 25th, 2020
- - February 27th, 2020
- - February 20th, 2020
- - February 13th, 2020
- - February 6th, 2020