Server/DC-MHS

Welcome

Welcome to the OCP DC-MHS Sub-Project.

DC-MHS R1 envisions interoperability between key elements of datacenter, edge and enterprise infrastructure by providing consistent interfaces and form factors among modular building blocks.

DC-MHS R1 standardizes a collection of HPM (Host Processor Modules) form-factors and supporting ingredients to allow interoperability of HPMs and platforms.

There are six workstreams that comprise DC-MHS. The objectives of the six workstreams are the following:

• M-FLW (FulL Width HPM)
  • Specify the requirements of a Full Width Host Processor Module (HPM). This is for use within products designed for minimum 19" rack, also known as compliant with EIA-310-E but can also accommodate larger 21" racks. This form factor enables a full width HPM usage for CPUs, DIMMs, and related features.

• M-DNO (DeNsity Optimized HPM)
  • Outline the requirements of a family of partial width, DeNsity Optimized Host Processor Module (HPM) form factors within the OCP Modular 240 hardware system group of specifications (M-DNO for short). This M-DNO specification embodies design considerations for CPU, DIMMs, and other server processor related features commonly used by the industry today but is not limited to only those functions.
• M-XIO/PESTI ( (eXtended I/O Connectivity/PEripheral SideBand Tunneling Interface) :
  • Outline the Modular Extensible I/O (M-XIO) source connector hardware strategy. An M-XIO source connector enables entry and exit points between sources such as Motherboards, Host Processor Modules & RAID Controllers, and peripheral subsystems such as PCIe risers, backplanes, etc. M-XIO includes the connector, high speed and management signal interface details and supported pinouts. Additionally, the workstream defines Interface (M-PESTI) base requirements for electrical and protocol compatibility between components of a DC-MHS platform. The M-PESTI protocol overloads a common PRSNT# signal with additional capabilities beyond simple presence/absence of a peripheral.
• M-PIC (Platform Infrastructure Connectivity)
  • Defines and standardizes common elements needed to interface a Host Processor Module (HPM) to the platform/chassis infrastructure elements/subsystems within the DC-MHS 1.0 family of OCP servers. Standardization of the common interfaces and connectors enables hardware compatibility between DC-MHS HPMs and various DC-MHS system components.
• M-CRPS (Common Redundant Power Supply)
  • Defines all the requirements for an M-CRPS internal redundant power supply used in Open Compute Project that could be used in different environments like home/office, datacenter, and high-performance computing, hence harmonizing the server power supply requirements used in the industry with the purpose of creating a standard specification that the customers and vendors of Enterprise and Hyperscale can use for their products.
• M-SIF (Shared InFrastructure)
  • Improve interoperability related to shared infrastructure enclosures with multiple, serviceable modules. Modules containing elements (HPMs, DC-SCM, peripherals, etc.) are blind-matable and hot-pluggable into a shared infrastructure enclosure.

Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found on the OCP Policies page. If you have any questions please contact OCP.

Project Leadership

Sub-Project Leads

• Brian Aspnes (Intel)
• Shawn Dube (Dell)

Workstream Leads

• M-FLW: Brian Aspnes (Intel) and Corey Hartman (Dell)
• M-DNO: Dirk Blevins (Intel) and Mike Gregoire (Dell)
• M-XIO/PESTI: Charlie Ziegler (Dell) and Javier Lasa (Intel)
• M-PIC: Tim Lambert (Dell) and Cliff DuBay (Intel)
• M-CRPS: Aurelio Rodriguez Echevarria (Intel) and Jon Lewis (Dell)
• M-SIF: Dirk Blevins (Intel) and Greg Sellman (AMD)

Incubation Committee Representative

• Siamak Tavallaei (Google)

DC-MHS Wiki Administrator

• John Dinsmoor (Intel)

Current Status

DC-MHS R1 v1.0 specs have been approved by the OCP Incubation Committee in November 2022.

DC-MHS workstreams are working the DC-MHS R1 v1.1 specifications. Note: M-SIF is a workstream new to DC-MHS. M-SIF is working on v1.0 specification.

Latest Base Specifications

Type	Description	Version	Submit Date	Contributor	License	Notes
Specification	DC-MHS v1.0 specifications: M-FLW_R1_v1p0 M-DNO_R1_v1p0 M-XIO_R1_v1p0 M-PIC_R1_v1p0 M-CRPS_R1_v1p0 M-PESTI_R1_v1p0	R1-v1.0_RC	9/28/2022	DC-MHS CLA group	OWF	Reviewed in Oct meeting. Approved by the IC on 11/4/2022 Final specifications are in the Contribution Database

Active Documents

Documents and information on sub-groups are in the Wiki links above. Documents from the main Server group are below.

Type	Description	Version	Submit Date	Contributor	License	Notes

Get Involved

• Mailing List
• OCP Calendar

Communication

• Project communication is done through https://ocp-all.groups.io/g/OCP-DC-MHS
• Post: mailto:OCP-DC-MHS@OCP-All.groups.io
• Subscribe: mailto:OCP-DC-MHS+subscribe@OCP-All.groups.io
• Unsubscribe: mailto:OCP-DC-MHS+unsubscribe@OCP-All.groups.io
• Please make sure to follow the steps until you receive 1) confirmation email from noreply@Groups.io 2) welcome email from OCP-DC-MHS@OCP-All.groups.io
• Please check your junk box and unblock noreply@Groups.io if you have trouble receiving the confirmation email
• To access the mailing list archives go to https://ocp-all.groups.io/g/OCP-DC-MHS

Meeting Schedule

For monthly public meetings:

• Schedule is TBD
• Each workstream has its own weekly meeting for companies that have signed the DC-MHS R1 CLA.

Recordings from Past Monthly Meeting Calls

• TBD

Slides from April 2022 OCP Tech Talks

Presenters (Company)	Title	Video	Slides
Shawn Dube (Dell), Brian Aspnes (Intel)	DC-MHS Rev 1.0: Introduction and Overview (Datacenter - Modular Hardware System)	Video	Slides
Corey Hartman (Dell), Brian Aspnes (Intel)	DC-MHS: FulL Width HPMs (M-FLW)	Video	Slides
Mike Gregoire (Dell), Dirk Blevins (Intel)	DC-MHS: DeNsity Optimized HPMs (M-DNO)	Video	Slides
Cliff DuBay (Intel), Tim Lambert (Dell)	DC-MHS: Peripheral Infrastructure Connectivity (M-PIC)	Video	Slides
Charlie Ziegler (Dell), Javier Lasa (Intel)	DC-MHS: eXtensible I/O (M-XIO)	Video	Slides
Tim Lambert (Dell), Javier Lasa (Intel)	DC-MHS: PEripheral Sideband Tunneling Interface (M-PESTI)	Video	Slides
Aurelio Rodriguez (Intel), Jon Lewis (Dell)	DC-MHS: Common Redundant Power Supply (M-CRPS)	Video	Slides

Slides/Recordings from October 2022 OCP Global Summit

Presenter	Title	Video	Slides
Aurelio Rodriguez Echevarria (Intel Corporation) | Corey Hartman (Dell) | Tim Lambert (Dell Inc.) | Eduardo Estrada (Intel Corporation)	PANEL: DC-MHS R1 report-out and timeline	Video	Slides
Brian Aspnes (Intel Corporation) | Shawn Dube (Dell) | Jean-Marie Verdun (HPE) | Dharmesh Jani (Meta)	PANEL: Datacenter Modular Hardware System (DC-MHS)	Video	Slides
Todd Westhauser (Meta) | Vincent Nguyen (HPE)	Practical Usage of DC-MHS M-DNO Concepts	Video	Slides
Dirk Blevins (Intel Corporation)	Multi-host Modular Systems	Video	Slides

OCP Marketplace Entries

The most recent documents will always be in the OCP Marketplace, Specifications & Design Collateral

• http://www.opencompute.org/contributions

or the OCP Marketplace, Orderable Products

• http://www.opencompute.org/products

Entries below are for ease of use and historical reference. Please use the marketplace links for the most recent documents.

Type	Description	Version	Submit Date	Contributor	License	Notes