Server/NIC: Difference between revisions
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2. Update pin out to OCP 3.0 Pinout Proposal 20171205a_TN | 2. Update pin out to OCP 3.0 Pinout Proposal 20171205a_TN | ||
3. Specification draft complete rate | 3. Specification draft complete rate (Estimation) | ||
{| class="wikitable" | {| class="wikitable" | ||
| Line 156: | Line 156: | ||
|- | |- | ||
|1. Overview | |1. Overview | ||
| | | 70% drafted | ||
| | | finishing up / under review | ||
|- | |- | ||
|2. Card form factor | |2. Card form factor | ||
| | | 60+% drafted | ||
| | | finishing up / under review | ||
|- | |- | ||
|3. Card Edge and baseboard interface | |3. Card Edge and baseboard interface | ||
| | | 80+ % drafted | ||
| | | Under review | ||
|- | |||
|4. Management | |||
|0% drafted | |||
|Need to work on | |||
|- | |||
|5. Data Network requirement | |||
|TBD | |||
|Same content as Mezz 2.0; check for need to keep this chapter | |||
|- | |||
|6. Card routing guideline and SI consideration | |||
|TBD | |||
|NCSI specified on card; PCIe TBD | |||
|- | |||
|7. Thermal and Environmental | |||
|TBD | |||
|Need edit based on Mezz 2.0 | |||
|} | |} | ||
4. Key mechanical updates: | |||
- Agreed on guiding feature and card sizes | |||
- Reduce to 2x sizes (Small and Large form factors; detail see latest spec draft) | |||
To be closed: | |||
- Front bracket / latching mechanism design for small and large form factors | |||
- Right Angle connector vertical offset(3.05mm vs. 3.50mm); Need to decide and close based on Tolerance analysis | |||
- Straddle Mount connector offset and PCB footprint; Need to decide and close based on 1U use case study | |||
5. Coming working sessions and proposal of agenda: | |||
-#7 12/6 : 2hr working session; ME and EE runs in parallel; close on ME opens and clarify the rest of draft work | |||
-#8 12/13: 3-4hr: all draft work done for 1st pass of edit. 1st cross review | |||
-#9 12/20: 3-4hr: Review changes and post 1st draft | |||
Revision as of 08:18, 6 December 2017
Welcome
Welcome to the OCP Mezzanine NIC subgroup under OCP Server Work Group. The goal of this subgroup is to form a healthy ecosystem in Mezzanine NIC space, under OCP framework.
Guideline
We are here to build a supportive, informative and inclusive community:
Supportive
- Support implementation questions
- Evaluate new use cases
Informative
- Share the latest topics and trends related to OCP Mezz NIC spec
- Share both challenges and opportunities
Inclusive
- Take community feedback and make iterations to proposal before submitting major revision to work group and IC
- Open to both adopters, and observers
Get Involved
Updated doc
| Doc | Version | Date | Contributor | Notes |
|---|---|---|---|---|
| OCP_NIC_3.0_draft_0v01_20171205c_TN | 0v01 | 12/05/2017 | OCP NIC subgroup | Draft - Spec Working in progress |
| OCP 3.0 OCP 3.0 Pinout Proposal 20171205a_TN | 20171205a_TN | 12/05/2017 | Intel | Pinout Proposal |
| OCP_NIC_3.0_discussion_r10_20170920 | v10 | 9/20/2017 | General deck;updated before 9/20 call | |
| Mezz3.0 schedule v4_20170816 | v4 | 8/16/2017 | OCP NIC 3.0 spec project schedule; commented on 9/6/2017 | |
| OCP NIC 3.0_Mechanical Discussion_v04_20171027 | v4 | 10/27/2017 | Mechanical Deck | |
| OCP_NIC_3_3D_CAD_r2_20170920 | v2 | 9/20/2017 | Mechanical 3D package | |
| Thermal Deck_v7_20171115 | v7 | 11/15/2017 | Thermal deck | |
| Updated thermal Simulation Results_v7_20171103 | v7 | 11/3/2017 | Thermal simulation result update | |
| OCP_Mezz_thermal_model_v3_20171103 | v3 | 11/3/2017 | Thermal simulation model package | |
| HPE_Comments_on_OCP_Mezz_v3_20170816 | N/A | 8/16/2017 | HPE | Presentation from HPE on 8/16/2017 call |
| Dell EMC - OCP NIC Presntation v1_20170906 | v1 | 9/6/2017 | Dell-EMC | Presentation from Dell-EMC on 9/6/2017 call |
| Lenovo OCP Mezz3.0 Recommendations - 20170901 | N/A | 9/1/2017 | Lenovo | A mechanical focused presentation from Lenovo on 9/6/2017 call |
| 9/25/2017 Workshop decks | N/A | 9/25/2017 | Microsoft / TE / Amphenol / Broadcom / Intel / Facebook | 9/25/2017 workshop slides from multiple contributors |
| 9/25/2017 Workshop recording (large file 908MB) | N/A | 9/25/2017 | Microsoft / TE / Amphenol / Broadcom / Intel / Facebook | 9/25/2017 workshop recording from multiple contributors |
Updates
12/5 update
1. Update spec draft to OCP_NIC_3.0_draft_0v01_20171205c_TN
2. Update pin out to OCP 3.0 Pinout Proposal 20171205a_TN
3. Specification draft complete rate (Estimation)
| Chapter | Draft complete rate | Status |
|---|---|---|
| 1. Overview | 70% drafted | finishing up / under review |
| 2. Card form factor | 60+% drafted | finishing up / under review |
| 3. Card Edge and baseboard interface | 80+ % drafted | Under review |
| 4. Management | 0% drafted | Need to work on |
| 5. Data Network requirement | TBD | Same content as Mezz 2.0; check for need to keep this chapter |
| 6. Card routing guideline and SI consideration | TBD | NCSI specified on card; PCIe TBD |
| 7. Thermal and Environmental | TBD | Need edit based on Mezz 2.0 |
4. Key mechanical updates:
- Agreed on guiding feature and card sizes
- Reduce to 2x sizes (Small and Large form factors; detail see latest spec draft)
To be closed:
- Front bracket / latching mechanism design for small and large form factors
- Right Angle connector vertical offset(3.05mm vs. 3.50mm); Need to decide and close based on Tolerance analysis
- Straddle Mount connector offset and PCB footprint; Need to decide and close based on 1U use case study
5. Coming working sessions and proposal of agenda:
-#7 12/6 : 2hr working session; ME and EE runs in parallel; close on ME opens and clarify the rest of draft work
-#8 12/13: 3-4hr: all draft work done for 1st pass of edit. 1st cross review
-#9 12/20: 3-4hr: Review changes and post 1st draft
11/20 update
1. Updated specification(11/12) and pin definition(11/15) to the "updated doc session"; The spec still needs a lot of work in the coming a few weeks.
2. Thermal deck v7 is uploaded (same material as presented on 11/15)
10/31 update
1. We did 4x working session so far and made good progress in pinout and mechanical profile
- 10/11 11:30am-3pm(PDT) - Done: TE/Dell-EMC/Intel/FB
- 10/18 9am-2pm(PDT) - Done: TE/Dell-EMC/Lenovo/Broadcom/Intel/FB
- 10/27 8am - 11am(PDT) Done: – TE/Dell-EMC/Lenovo/Broadcom/Intel/FB
- 10/31 8:30am - 10am(PDT) Done: - (Pinout specific session) Mellanox / Broadcom / Intel / Dell-EMC / FB
- 11/3 8am-11am(PDT)
- 11/15 9am-5pm(PST)
2. Latest pin out and ME deck are posted at Table above
3. Plan to post WIP specification draft after 11/3 workshop for broader review
4. We will cancel the 2017/11/01 meeting as FB team has a conflict
10/18 Update
- Intel/Dell-EMC/TE/FB joined the spec drafting working session on 10/11 and worked on these topics: framework, sections, pinout, connector, specification drafting logistics.
- With many inputs from community, FB updated Mechanical deck to v3; Key changes are 1) fine tuning module width by 2mm 2) proposing 1 extra sizes, and total 3x sizes with different width. Detail see Mechanical Discussion_v03_20171018
- Pinout is being actively working on. Intel is taking lead on proposing and maintaining the draft; an updated version can be found [here]
- We will move from Fuze to GoToWebinar for project calls in Nov. 10/18 call is likely the last call on Fuze. More details to follow in mailing list and calendar.
9/20 Update
- The subgroup closed on all other major options after a few months of iterations. #14 is the clear preference in subgroup. Details and specification will be worked out around this option.
- Update main deck: OCP_NIC_3.0_discussion_r10_20170920
- Update mechanical 3D package to r02
- Update mechanical deck to r02
9/6 Update
- Add updated doc session for better tracking of latest docs and community presentations
- Update general deck to v9, thermal deck to v6
- Intend to exit phase 2 by 9/20 with option #14
- Change project name from "OCP Mezz NIC 3.0" to "OCP NIC 3.0" as option #14 is not Mezz style
8/23 Update
HPE's presentation on 8/16 call
8/22 Update
Thermal results and files
- Option #13 with QSFP heat sink
- Option #14 with QSFP heat sink
- Slides - Update of thermal results
- Summary of updated simulation results
8/16 Update
Master Deck r08 dated 8/16/2017
Mechanical update r01 dated 8/16/2017
Mechanical - 3D of option 14 v1
8/2 Update
1. Update to deck
Master Deck r07 dated 8/1/2017
2. 8/2/2017 Meeting Agenda
General update
- Form factor stability goal (2+5+2 goal)
- Update the investigation of #14
- Revisit 1x or 2x form factor (tradeoff between simplicity and flexibility)
- Heads up of stating pin list discussion
Possible project name change
- One of the major option(#14) being looked at is not technical a "Mezz"
- Possible name change of project if the group is clearly trending toward #14
Mechanical intro - by Joshua Held @Facebook
- Josh will talk about coming activities in mechanical design of Mezz NIC
9/25 Workshop @ Dallas, TX
- Call for presentation; topical can be technically, or sharing how your experience with OCP Mezz NIC
- Suggest to drop me an email if you intend to attend (optional) - Free to register; instruction sent in mailing list
7/25/2017
1. Update to deck
7/14/2017
1. Update to deck
2. Update to Schedule
3. Mezz subgroup will meet @ OCP Engineering workshop Sep 25th, 2017
7/5/2017
See below material for tomorrow's call:
Corrected thermal model: Cases A1-A5
Corrected thermal model: Cases A6-A10
Thermal model with QSFP heat sink: Cases A1-A5
Thermal model with QSFP heat sink: Cases A6-A10
Summary of updated simulation results
--- Agenda
1. Updates and corrections to thermal models
2. Impact of QSFP heat sink
3. Impact of contact resistance on QSFP heat sink performance
4. Go over a few topics for discussion
Find archive of mailing-list here
Meetings
This project meets - 2 times a Month; Defaults to 1st and 3rd Wednesday of the Month.
Call-in info and source of truth @ http://opencompute.org/projects/projects-calendar/ (Time zone shown: Eastern Time)
This call is open to the public.
If there is a cancellation, we will try our best to cancel >24hrs before the meeting by the calendars above.
Meeting minutes is sent out in mailing list and can be found at archive
Events
2017/3/9
OCP Engineering Workshop Sessions https://ocpussummit2017.sched.com/event/9SAa/ocp-mezzanine-nic-20-and-beyond
More information about OCP events can be found at: http://www.opencompute.org/community/events/ocp-events-calendar
Communication
- Project communication is done through the opencompute-mezz-card mailing list.
- Please make sure following the steps until you receive confirmation email and welcome email from Opencompute-mezz-card@lists.opencompute.org.
Please check your junk box and unblock Opencompute-mezz-card@lists.opencompute.org if you have trouble getting confirmation email.
- To access the mailing list archives go to: http://lists.opencompute.org/pipermail/opencompute-mezz-card/
- For general discussion, please use mailing-list above by default; This is public domain and all discussion is archived
- Reach to Jia Ning if there is strong reason not to have public discussion
Specifications and Designs
| Specification | Version | Submit Date | Contributor | License | Notes |
|---|---|---|---|---|---|
| OCP Mezzanine card v2.0
OCP_Mezz_2.0_rev1.00_20151215b_pub_release.pdf(2.2MB) OCP_Mezz_2.0_rev1.00_20151215b_pub_release_3D_package.zip (88MB) |
V2.0-1.0 | Dec 15, 2015 | OWFa 1.0 | Added support for x16 (quad x4), NCSI, dual QSFP+, & Quad SDP+ Accepted by OCP IC 2/24/2016 | |
| OCP Mezzanine card v0.5, original standard | V0.5 | Oct 8, 2012 | OWFa 1.0 | Defacto standard for the original network mezzanine with a x8 PCIe Gen3 interface |