Server/NIC

Welcome

Welcome to the OCP Mezzanine NIC subgroup under OCP Server Work Group. The goal of this subgroup is to form a healthy ecosystem in Mezzanine NIC space, under OCP framework.

Guideline

We are here to build a supportive, informative and inclusive community:

Supportive

- Support implementation questions

- Evaluate new use cases

Informative

- Share the latest topics and trends related to OCP Mezz NIC spec

- Share both challenges and opportunities

Inclusive

- Take community feedback and make iterations to proposal before submitting major revision to work group and IC

- Open to both adopters, and observers

Get Involved

Updated doc

Doc	Version	Date	Contributor	Notes
OCP_NIC_3.0_draft_0v01_20171219c_TN	0v01	12/19/2017	OCP NIC subgroup	Draft - Spec Working in progress
OCP 3.0 OCP 3.0 Pinout Proposal 20171205a_TN	20171205a_TN	12/05/2017	Intel	Pinout Proposal
OCP_NIC_3.0_discussion_r10_20170920	v10	9/20/2017	Facebook	General deck;updated before 9/20 call
Mezz3.0 schedule v4_20170816	v4	8/16/2017	Facebook	OCP NIC 3.0 spec project schedule; commented on 9/6/2017
OCP NIC 3.0_Mechanical Discussion_v04_20171027	v4	10/27/2017	Facebook	Mechanical Deck
OCP_NIC_3_3D_CAD_r2_20170920	v2	9/20/2017	Facebook	Mechanical 3D package
Thermal Deck_v7_20171115	v7	11/15/2017	Facebook	Thermal deck
Updated thermal Simulation Results_v7_20171103	v7	11/3/2017	Facebook	Thermal simulation result update
OCP_Mezz_thermal_model_v3_20171103	v3	11/3/2017	Facebook	Thermal simulation model package
HPE_Comments_on_OCP_Mezz_v3_20170816	N/A	8/16/2017	HPE	Presentation from HPE on 8/16/2017 call
Dell EMC - OCP NIC Presntation v1_20170906	v1	9/6/2017	Dell-EMC	Presentation from Dell-EMC on 9/6/2017 call
Lenovo OCP Mezz3.0 Recommendations - 20170901	N/A	9/1/2017	Lenovo	A mechanical focused presentation from Lenovo on 9/6/2017 call
9/25/2017 Workshop decks	N/A	9/25/2017	Microsoft / TE / Amphenol / Broadcom / Intel / Facebook	9/25/2017 workshop slides from multiple contributors
9/25/2017 Workshop recording (large file 908MB)	N/A	9/25/2017	Microsoft / TE / Amphenol / Broadcom / Intel / Facebook	9/25/2017 workshop recording from multiple contributors

Updates

12/5 update

1. Update spec draft to OCP_NIC_3.0_draft_0v01_20171205c_TN

2. Update pin out to OCP 3.0 Pinout Proposal 20171205a_TN

3. Specification draft complete rate (Estimation)

Chapter	Draft complete rate	Status
1. Overview	70% drafted	finishing up / under review
2. Card form factor	60+% drafted	finishing up / under review
3. Card Edge and baseboard interface	80+ % drafted	Under review
4. Management	0% drafted	Need to work on
5. Data Network requirement	TBD	Same content as Mezz 2.0; check for need to keep this chapter
6. Card routing guideline and SI consideration	TBD	NC-SI specified on card; PCIe TBD
7. Thermal and Environmental	TBD	Need edit based on Mezz 2.0

4. Key mechanical updates:

- Agreed on guiding feature and card sizes

- Reduce to 2x sizes (Small and Large form factors; detail see latest spec draft)

To be closed:

- Front bracket / latching mechanism design for small and large form factors

- Right Angle connector vertical offset(3.05mm vs. 3.50mm); Need to decide and close based on Tolerance analysis

- Straddle Mount connector offset and PCB footprint; Need to decide and close based on 1U use case study

5. Coming working sessions and proposal of agenda:

-#7 12/6 : 2hr working session; ME and EE runs in parallel; close on ME opens and clarify the rest of draft work

-#8 12/13: 3-4hr: All draft work due for 1st pass of edit of all chapters. 1st cross review with changes suggested and agreed

-#9 12/20: 3-4hr: Review changes and post 1st draft

11/20 update

1. Updated specification(11/12) and pin definition(11/15) to the "updated doc session"; The spec still needs a lot of work in the coming a few weeks.

2. Thermal deck v7 is uploaded (same material as presented on 11/15)

10/31 update

1. We did 4x working session so far and made good progress in pinout and mechanical profile

- 10/11 11:30am-3pm(PDT) - Done: TE/Dell-EMC/Intel/FB

- 10/18 9am-2pm(PDT) - Done: TE/Dell-EMC/Lenovo/Broadcom/Intel/FB

- 10/27 8am - 11am(PDT) Done: – TE/Dell-EMC/Lenovo/Broadcom/Intel/FB

- 10/31 8:30am - 10am(PDT) Done: - (Pinout specific session) Mellanox / Broadcom / Intel / Dell-EMC / FB

- 11/3 8am-11am(PDT)

- 11/15 9am-5pm(PST)

2. Latest pin out and ME deck are posted at Table above

3. Plan to post WIP specification draft after 11/3 workshop for broader review

4. We will cancel the 2017/11/01 meeting as FB team has a conflict

10/18 Update

- Intel/Dell-EMC/TE/FB joined the spec drafting working session on 10/11 and worked on these topics: framework, sections, pinout, connector, specification drafting logistics.

- With many inputs from community, FB updated Mechanical deck to v3; Key changes are 1) fine tuning module width by 2mm 2) proposing 1 extra sizes, and total 3x sizes with different width. Detail see Mechanical Discussion_v03_20171018

- Pinout is being actively working on. Intel is taking lead on proposing and maintaining the draft; an updated version can be found [here]

- We will move from Fuze to GoToWebinar for project calls in Nov. 10/18 call is likely the last call on Fuze. More details to follow in mailing list and calendar.

9/20 Update

- The subgroup closed on all other major options after a few months of iterations. #14 is the clear preference in subgroup. Details and specification will be worked out around this option.

- Update main deck: OCP_NIC_3.0_discussion_r10_20170920

- Update mechanical 3D package to r02

- Update mechanical deck to r02

9/6 Update

- Add updated doc session for better tracking of latest docs and community presentations

- Update general deck to v9, thermal deck to v6

- Intend to exit phase 2 by 9/20 with option #14

- Change project name from "OCP Mezz NIC 3.0" to "OCP NIC 3.0" as option #14 is not Mezz style

8/23 Update

HPE's presentation on 8/16 call

8/22 Update

Thermal results and files

- Option #13 with QSFP heat sink

- Option #14 with QSFP heat sink

- Slides - Update of thermal results

- Summary of updated simulation results

8/16 Update

Master Deck r08 dated 8/16/2017

Mechanical update r01 dated 8/16/2017

Mechanical - 3D of option 14 v1

8/2 Update

1. Update to deck

Master Deck r07 dated 8/1/2017

2. 8/2/2017 Meeting Agenda

General update

- Form factor stability goal (2+5+2 goal)

- Update the investigation of #14

- Revisit 1x or 2x form factor (tradeoff between simplicity and flexibility)

- Heads up of stating pin list discussion

Possible project name change

- One of the major option(#14) being looked at is not technical a "Mezz"

- Possible name change of project if the group is clearly trending toward #14

Mechanical intro - by Joshua Held @Facebook

- Josh will talk about coming activities in mechanical design of Mezz NIC

9/25 Workshop @ Dallas, TX

- Call for presentation; topical can be technically, or sharing how your experience with OCP Mezz NIC

- Suggest to drop me an email if you intend to attend (optional) - Free to register; instruction sent in mailing list

7/25/2017

1. Update to deck

Master Deck V6 dated 7/25

7/14/2017

1. Update to deck

Master Deck V5 dated 7/14

2. Update to Schedule

Schedule update v3 dated 7/14

3. Mezz subgroup will meet @ OCP Engineering workshop Sep 25th, 2017

More info here

7/5/2017

See below material for tomorrow's call:

Corrected thermal model: Cases A1-A5

Corrected thermal model: Cases A6-A10

Thermal model with QSFP heat sink: Cases A1-A5

Thermal model with QSFP heat sink: Cases A6-A10

Summary of updated simulation results

Presentation slides

--- Agenda

1. Updates and corrections to thermal models

2. Impact of QSFP heat sink

3. Impact of contact resistance on QSFP heat sink performance

4. Go over a few topics for discussion

---

Find Archive of updates here

Find archive of mailing-list here

---

Meetings

This project meets - 2 times a Month; Defaults to 1st and 3rd Wednesday of the Month.

Call-in info and source of truth @ http://opencompute.org/projects/projects-calendar/ (Time zone shown: Eastern Time)

This call is open to the public.

If there is a cancellation, we will try our best to cancel >24hrs before the meeting by the calendars above.

Meeting minutes is sent out in mailing list and can be found at archive

Events

2017/3/9

OCP Engineering Workshop Sessions https://ocpussummit2017.sched.com/event/9SAa/ocp-mezzanine-nic-20-and-beyond

More information about OCP events can be found at: http://www.opencompute.org/community/events/ocp-events-calendar

Communication

- Project communication is done through the opencompute-mezz-card mailing list.

- Please make sure following the steps until you receive confirmation email and welcome email from Opencompute-mezz-card@lists.opencompute.org.

Please check your junk box and unblock Opencompute-mezz-card@lists.opencompute.org if you have trouble getting confirmation email.

- To access the mailing list archives go to: http://lists.opencompute.org/pipermail/opencompute-mezz-card/

- For general discussion, please use mailing-list above by default; This is public domain and all discussion is archived

- Reach to Jia Ning if there is strong reason not to have public discussion

Specifications and Designs

All these accepted by the IC

Specification	Version	Submit Date	Contributor	License	Notes
OCP Mezzanine card v2.0 OCP_Mezz_2.0_rev1.00_20151215b_pub_release.pdf(2.2MB) OCP_Mezz_2.0_rev1.00_20151215b_pub_release_3D_package.zip (88MB) Mechanical 20151023_P1-P9_K1-K5 zip file (57MB)	V2.0-1.0	Dec 15, 2015	Facebook	OWFa 1.0	Added support for x16 (quad x4), NCSI, dual QSFP+, & Quad SDP+ Accepted by OCP IC 2/24/2016
OCP Mezzanine card v0.5, original standard Mezzanine Card (rev 0.5)	V0.5	Oct 8, 2012	Facebook	OWFa 1.0	Defacto standard for the original network mezzanine with a x8 PCIe Gen3 interface