Server/NIC

Welcome

Welcome to the OCP Mezzanine NIC subgroup under OCP Server Work Group. The goal of this subgroup is to form a healthy ecosystem in Mezzanine NIC space, under OCP framework.

Guideline

We are here to build a supportive, informative and inclusive community:

Supportive

- Support implementation questions

- Evaluate new use cases

Informative

- Share the latest topics and trends related to OCP Mezz NIC spec

- Share both challenges and opportunities

Inclusive

- Take community feedback and make iterations to proposal before submitting major revision to work group and IC

- Open to both adopters, and observers

Get Involved

Updated doc

Doc	Version	Date	Contributor	Notes
OCP_NIC_3.0_draft_0v50_20171222i_TN	0v01	12/22/2017	OCP NIC subgroup	Draft - 90%+ complete; public review and feedback is welcome. Send feedback=> opencompute-mezz-card@lists.opencompute.org
OCP 3.0 OCP 3.0 Pinout Proposal 20171205a_TN	20171205a_TN	12/05/2017	Intel	Pinout Proposal
OCP_NIC_3.0_discussion_r11_20171219	v11	12/19/2017	OCP NIC Subgroup	General deck;updated before 12/20 call
Mezz3.0 schedule v6_20171219	v6	12/19/2017	Facebook	OCP NIC 3.0 spec project schedule
OCP NIC 3.0_Mechanical Discussion_v5_20171201_d	v5	12/01/2017	Facebook	Mechanical Deck
OCP_NIC_3_3D_CAD_r2_20170920	v2	9/20/2017	Facebook	Mechanical 3D package
Thermal Deck_v7_20171115	v7	11/15/2017	Facebook	Thermal deck
Updated thermal Simulation Results_v7_20171103	v7	11/3/2017	Facebook	Thermal simulation result update
OCP_Mezz_thermal_model_v3_20171103	v3	11/3/2017	Facebook	Thermal simulation model package
HPE_Comments_on_OCP_Mezz_v3_20170816	N/A	8/16/2017	HPE	Presentation from HPE on 8/16/2017 call
Dell EMC - OCP NIC Presntation v1_20170906	v1	9/6/2017	Dell-EMC	Presentation from Dell-EMC on 9/6/2017 call
Lenovo OCP Mezz3.0 Recommendations - 20170901	N/A	9/1/2017	Lenovo	A mechanical focused presentation from Lenovo on 9/6/2017 call
9/25/2017 Workshop decks	N/A	9/25/2017	Microsoft / TE / Amphenol / Broadcom / Intel / Facebook	9/25/2017 workshop slides from multiple contributors
9/25/2017 Workshop recording (large file 908MB)	N/A	9/25/2017	Microsoft / TE / Amphenol / Broadcom / Intel / Facebook	9/25/2017 workshop recording from multiple contributors

Updates

1/2/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v50_20171222i_TN 2. Move updates before 12/1/2017 to archive

12/20/2017 update

1. Updated spec draft, overview deck, and mechanical deck

12/5/2017 update

1. Update spec draft to OCP_NIC_3.0_draft_0v01_20171205c_TN

2. Update pin out to OCP 3.0 Pinout Proposal 20171205a_TN

3. Specification draft complete rate (Estimation)

Chapter	Draft complete rate	Status
1. Overview	70% drafted	finishing up / under review
2. Card form factor	60+% drafted	finishing up / under review
3. Card Edge and baseboard interface	80+ % drafted	Under review
4. Management	0% drafted	Need to work on
5. Data Network requirement	TBD	Same content as Mezz 2.0; check for need to keep this chapter
6. Card routing guideline and SI consideration	TBD	NC-SI specified on card; PCIe TBD
7. Thermal and Environmental	TBD	Need edit based on Mezz 2.0

4. Key mechanical updates:

- Agreed on guiding feature and card sizes

- Reduce to 2x sizes (Small and Large form factors; detail see latest spec draft)

To be closed:

- Front bracket / latching mechanism design for small and large form factors

- Right Angle connector vertical offset(3.05mm vs. 3.50mm); Need to decide and close based on Tolerance analysis

- Straddle Mount connector offset and PCB footprint; Need to decide and close based on 1U use case study

5. Coming working sessions and proposal of agenda:

-#7 12/6 : 2hr working session; ME and EE runs in parallel; close on ME opens and clarify the rest of draft work

-#8 12/13: 3-4hr: All draft work due for 1st pass of edit of all chapters. 1st cross review with changes suggested and agreed

-#9 12/20: 3-4hr: Review changes and post 1st draft

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Find Archive of updates here

Find archive of mailing-list here

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Meetings

This project meets - 2 times a Month; Defaults to 1st and 3rd Wednesday of the Month.

Call-in info and source of truth @ http://opencompute.org/projects/projects-calendar/ (Time zone shown: Eastern Time)

This call is open to the public.

If there is a cancellation, we will try our best to cancel >24hrs before the meeting by the calendars above.

Meeting minutes is sent out in mailing list and can be found at archive

Events

2017/3/9

OCP Engineering Workshop Sessions https://ocpussummit2017.sched.com/event/9SAa/ocp-mezzanine-nic-20-and-beyond

More information about OCP events can be found at: http://www.opencompute.org/community/events/ocp-events-calendar

Communication

- Project communication is done through the opencompute-mezz-card mailing list.

- Please make sure following the steps until you receive confirmation email and welcome email from Opencompute-mezz-card@lists.opencompute.org.

Please check your junk box and unblock Opencompute-mezz-card@lists.opencompute.org if you have trouble getting confirmation email.

- To access the mailing list archives go to: http://lists.opencompute.org/pipermail/opencompute-mezz-card/

- For general discussion, please use mailing-list above by default; This is public domain and all discussion is archived

- Reach to Jia Ning if there is strong reason not to have public discussion

Specifications and Designs

All these accepted by the IC

Specification	Version	Submit Date	Contributor	License	Notes
OCP Mezzanine card v2.0 OCP_Mezz_2.0_rev1.00_20151215b_pub_release.pdf(2.2MB) OCP_Mezz_2.0_rev1.00_20151215b_pub_release_3D_package.zip (88MB) Mechanical 20151023_P1-P9_K1-K5 zip file (57MB)	V2.0-1.0	Dec 15, 2015	Facebook	OWFa 1.0	Added support for x16 (quad x4), NCSI, dual QSFP+, & Quad SDP+ Accepted by OCP IC 2/24/2016
OCP Mezzanine card v0.5, original standard Mezzanine Card (rev 0.5)	V0.5	Oct 8, 2012	Facebook	OWFa 1.0	Defacto standard for the original network mezzanine with a x8 PCIe Gen3 interface