Storage/Thermal Sim Methodology: Difference between revisions
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Welcome to the OCP '''Thermal Sim Methodology''' workstream page | Welcome to the OCP '''Thermal Sim Methodology''' workstream page | ||
The Thermal Sim Methodology | The Thermal Sim Methodology will try to standardize aspects of the thermal characterization of drives and systems to enable drive and system designers to use common methods, metrics, and assumptions when designing for thermal targets required by end-users. The goal of the methodology is to enable both "apples-to-apples" comparison of drives in a system, and also to enable the ecosystem to better anticipate thermal requirements of new form factors being considered by the ecosystem. | ||
Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found on the OCP [http://www.opencompute.org/about/ocp-policies/ OCP Policies] page. If you have any questions please contact OCP. | Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found on the OCP [http://www.opencompute.org/about/ocp-policies/ OCP Policies] page. If you have any questions please contact OCP. | ||
Revision as of 22:48, 24 July 2020
WELCOME
Welcome to the OCP Thermal Sim Methodology workstream page
The Thermal Sim Methodology will try to standardize aspects of the thermal characterization of drives and systems to enable drive and system designers to use common methods, metrics, and assumptions when designing for thermal targets required by end-users. The goal of the methodology is to enable both "apples-to-apples" comparison of drives in a system, and also to enable the ecosystem to better anticipate thermal requirements of new form factors being considered by the ecosystem.
Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found on the OCP OCP Policies page. If you have any questions please contact OCP.
Links
Leads
- - Dave Landsman (Western Digital)
Documents
- - Thermal Workgroup Goals
- - E3 Thermal Methodology Slides
- - EDSFF Thermal Sim Spec Outline Doc
- - Intel-WDC-Microsoft - SSD Thermal Simulation Standardization
Meetings
Meeting Information: Every Thursday at 3pm-4pm US Pacific Time, though Thursday, August-27
You can also dial in using your phone. United States: +1 (646) 749-3122
Access Code: 881-571-341
Recordings from Past Calls
- - July 23rd, 2020
- - July 16th, 2020
- - June 25th, 2020
- - February 27th, 2020
- - February 20th, 2020
- - February 13th, 2020
- - February 6th, 2020