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==Welcome== | ==Welcome== | ||
Welcome to the OCP Open Domain-Specific Architecture | Welcome to the OCP Open Domain-Specific Architecture Sub-Project under the OCP Server Project. | ||
==Project Leadership== | ==Project Leadership== |
Revision as of 16:11, 1 April 2020
Welcome
Welcome to the OCP Open Domain-Specific Architecture Sub-Project under the OCP Server Project.
Project Leadership
Sub Project Lead
General Information
Charter (TBD)
Open Domain-Specific Accelerators: What Are They & Why Should They Matter?
Get Involved
Active Projects
Project | Objective | Point of Contact | Meeting Schedule |
---|---|---|---|
PHY Analysis | PHY requirements, PHY analysis & cross-PHY abstraction (PIPE) | Robert Wang (PIPE spec) | Weekly on Tuesday 9am Pacific |
BoW Interface | No technology license fee, east to port inter-chiplet interface spec | Bapi Vinnakota | Ad-Hoc |
Prototype | Product that integrates existing die from muktiple companies into one package | Jayaprakash Balachandran | Weekly on Wednesdays 1:30pm Pacific |
Chiplet Design Exchange | Open chiplet physical description format | Jawad Nasrullah | Weekly on Wednesdays 1:30pm Pacific |
Link and Network Layer | Interface and implementations - requirements and proposals | Bapi Vinnakota | Weekly on Thursdays 1pm Pacific |
Multi-chiplet test | Test requirements for an open chiplet interface | TBD | TBD |
Chiplet Monitoring | Monitoring infrastructure for chiplets | TBD | TBD |
Business workflow | Formalize learnings from prototype effort | Sam Fuller | Weekly on Tuesdays 3pm Pacific |
Overall | Sub-Project meeting | Bapi Vinnakota | Weekly on Fridays 8am Pacific |
Active documents
Type | Description | Version | Submit Date | Contributor | License | Notes |
---|---|---|---|---|---|---|
Introduction | odsa_ocp_intro.pdf | n/a | 2/27/19 | Netronome | n/a | Presented in 2/27 Server WG call. Introduction to ODSA sub-group under Server Project. Future entries will be in the ODSA WIki at: https://www.opencompute.org/wiki/Server/OAM |
White Paper (Draft) | Bunch of Wires Interface Proposal | Rev 0.7 | 10/26/19 | Authors: Mark Kuemerle, Ramin Farjad, Bapi Vinnakota | OCP CRLA |
Meeting Schedule & Call Link
Every Friday at 8am Pacific
Call Link (visit the OCP Server Project Calendar for other dial-in information)
Upcoming In Person Meetings
TBD
Recordings from Past Calls
- - March 27th, 2020 Recording Minutes ODSA Enabling Heterogenous Integration: Eelco Bergman - ASE Group
- - March 20th, 2020 Recording Minutes
- - March 13th, 2020 Recording Minutes
- - March 6th, 2020 Recording Minutes
- - February 28th, 2020 Recording Minutes CEI-112G-XSR-PAM4 Presentation
- - February 14th, 2020 Recording Minutes
- - February 7th, 2020 Recording Minutes
- - January 31st, 2020 Recording Minutes
- - January 24th, 2020 Recording Minutes
- - January 17th, 2020 Recording Minutes
- - January 10th, 2020 Recording Minutes
- - January 3rd, 2020 Recording Minutes
- - December 13th, 2019 Recording Minutes
- - December 6th, 2019 Recording Minutes
- - November 22nd, 2019 Recording Minutes
- - November 15th, 2019 Recording Minutes
- - November 8th, 2019 Recording Minutes
- - October 25th, 2019 Recording Minutes
- - October 18th, 2019 Recording Minutes
- - October 11th, 2019 Recording Minutes
- - October 4th, 2019 Recording Minutes
- - September 20th, 2019 Recording Minutes
- - September 6th, 2019 Recording Minutes
- - August 23rd, 2019 Recording Minutes
- - August 16th, 2019 Recording Minutes
- - August 9th, 2019 Recording Minutes
- - July 26th, 2019 Recording Minutes
- - July 19th, 2019 Recording Minutes
- - July 12th, 2019 Recording Minutes
- - June 21st, 2019 Recording Minutes
- - June 14th, 2019 Recording Minutes
- - May 31st, 2019 Recording Minutes
- - May 24th, 2019 Recording Minutes
- - May 17th, 2019 Recording Minutes
- - May 10th, 2019 Recording Minutes Modern Design Methodologies for Next-Gen Multi-Chip(let) Packaging Presentation - John Park, Cadence Protocols On Die-to-Die Interfaces Presentation - David Kehlet, Intel
- - May 3rd, 2019 Recording Minutes Chipset Design Exchange Presentation - Jawad Nasrullah, zGlue
- - April 26th, 2019 Recording Minutes
- - April 19th, 2019 Recording Minutes SIP Design Flow Presentation - Jawad Nasrullah, zGlue
- - April 12th, 2019 Recording Minutes
- - April 5th, 2019 Recording Minutes
Past Events
Topic | Speaker | Affiliation | Slides |
---|---|---|---|
ODSA Introduction | Bapi Vinnakota | OCP | Slides |
Topic | Speaker | Affiliation | Slides |
---|---|---|---|
ODSA Introduction | Bapi Vinnakota | OCP | Slides |
Facebook tech talk 1 - Co-packaged Optics | Katharine Schmidkte | Slides | |
Facebook tech talk 2 - D2D Interface | Ron Ho | Slides | |
IHS Markit survey results + Business workstream update | Sam Fuller | NXP | Slides |
Mapping protocols to D2D PHYs (Link Layer, PIPE,DiPort) | David Kehlet, Jaideep Dastidar, Sam Fuller, Imran Ahmed | Intel, NXP, Xilinx, AnalogX | Slides |
PoC Discussion | JP Balachandran, Joshua Raiff, Jawad Nasrullah, Sam Fuller, Jim Tavacoli, Quinn Jacobson | Cisco, Facebook, zGlue, NXP, Lattice, Achronix | Slides |
Open HBI D2D Interface Workstream | Kenneth Ma | Xilinx | Slides |
Cadence D2D Interface | Rishi Chugh/Wendy Wu | Cadence Design Systems | Slides |
BoW workgroup status update | Ramin Farjadrad | Marvell | Slides |
BoW interface initialization and calibration | Prakash Radhakrishnan | SiFive | |
Chiplets test panel | Dave Armstrong, Rajamani Sethuram, Liz Jensen, Karen Darbinyan | Advantest, Synopsys, nVidia, Cadence Design Systems | Armstrong Slides, Jensen Slides, Sethuram Slides, Zorian Slides |
CDX workstream updates | Jawad Nasrullah | zGlue | Slides |
Multiphysics simulation for chiplets | Chris Ortiz | ANSYS | Slides |
Topic | Speaker | Video | Slides |
---|---|---|---|
Executive Panel Collaborative Silicon Development | Moderator: Bapi Vinnakota (ODSA) | Video | Slides |
ODSA POC | Quinn Jacobson (Achronix), Jawad Nasrullah (zGlue), Jayaprakash Balachandran (Cisco) | Video | Slides |
Motivation for ODSA/Fit into OCP | Dharmesh Jani (Facebook) | Video | Slides |
The Open Domain Specific Architechure - A Technical Introduction | Bapi Vinnakota (ODSA) | Video | Slides |
Bunch of Wires Interface | Ramin Farjad (Aquantia), Mark Kuemerle (Global Foundries) | Video | Slides |
The Chiplet Design Exchange | Jawad Nasrullah (zGlue) | Video | Slides |
The Impact of Domain Specific Acceleration and Chiplet Technology on the Semiconductor and Electronics Business | (Avera Semi) | Video | [Slides] |
Topic | Speaker | Affiliation | Slides |
---|---|---|---|
Welcome/Logistics | Bapi Vinnakota/Mendy Furmanek | Netronome/IBM | |
Intro to OCP | Archna Haylock | OCP | |
IBM Welcome | Jeff Welser/Mendy Furmanek | IBM | |
Exploiting Composable Heterogeneity through Open Architectures | Josh Friedrich, Jeff Stuecheli | IBM | Slides |
ODSA Technical Intro/Progress Summary | Bapi Vinnakota | Netronome | Slides |
PoC Progress and Call for Participation | Jayaprakash Balachandran/Jawad Nasrullah/Manish Shah | Cisco/zGlue/Achronix | Slides |
BoW Interface Update | Mark Kuemerle | Avera Semi | Slides |
PIPE Interface Update | Robert Wang | Analog X | Slides |
Link Layer update | David Kehlet | Intel | Slides |
Open Uncore Panel | Z. Bandic, S. Fields, D. Jani, M. Kuemerle, mod B. Vinnakota | ||
Monitoring | Ashwin Poojary | Slides | |
Simulation Modeling | Animesh Mishra/Robbie Adler | Intel | Slides |
Xilinx and Chiplets | Millind Mittal | Xilinx | Slides |
IEEE Heterogeneous Integration Roadmap | Bill Chen | IEEE | Slides |
ASE Heterogeneous Packaging | Eelco Bergman | ASE | Slides |
Packaging and Test Panel | E. Bergman, M. Peng, W. Sauter, M. Hutner, mod S. Fuller | IEEE/IBM/Tesla/Avera/ASE | Video |
Topic | Speaker | Affiliation | Slides |
---|---|---|---|
Welcome/Logistics | Bapi Vinnakota/Animish Mishra | Netronome/Intel | Slides |
Intel Welcome | Ahmad Zaidi | Intel | |
Intel Chiplets and Packaging | Ramune Nagisetti and Ravi Mahajan | Intel | Slides |
Virtual Chiplet Platform | Animish Mishra/Robbie Adler | Intel | Slides |
ODSA Technical Intro | Bapi Vinnakota | Netronome | Slides |
PHY Review/BoM Interface Update | Ramin Farjadrad/Mark Kuemerle | Aquantia/Avera Semi | Slides |
AIB/Link Layer/Call to Action | David Kehlet | Intel | Slides |
Advanced Packaging for Chiplets | Surya Bhattacharya | IME Singapore | Slides |
Chiplet Design Experience | Panel | Intel/AMD/Cisco/eSilicon/Xilinx | Slides |
CDX - Chiplet Design Exchange | Jawad Nasrullah/Alex | zGlue/Ayar Labs | Slides |
Chiplet Microassembly Printer & Microsprings | Eugene Chow | Xerox PARC | Slides |
POC Update | JP/Quinn/Manish/Jawad/Mark | Cisco/Achronix/Samtec/zGlue | Slides |
Chiplet Workflow Experience | Panel | NXP/Avera Semi/Ayar Labs/Facebook/ Granite RIver Labs/Kandou | Slides |
Topic | Speaker | Affiliation | Slides |
---|---|---|---|
Welcome/Logistics | Bapi Vinnakota/Jim Finnegan | Netronome | Slides |
Welcome/Samsung Overview | Craig Orr | Samsung | Slides |
Accelerators | Whitney Zhao | Slides | |
ODSA technical introduction | Bapi Vinnakota | Netronome | Slides |
PHY Layer Review | Greg Taylor | zGlue | Slides |
BoW: Basic, Fast, Turbo Die-to-Die Open Interface Solutions | Mark Kuemerle/Ramin Farjad | Avera Semi/Aquantia | Slides |
Power distribution | Ali Husain | ON Semiconductor | Slides |
PIPE Adapter | Brian Holden | Kandou | Slides |
Design tools for muti-chip | Jawad Nasrullah | zGlue | Slides |
Speedster221 FPGA for POC | Quinn Jacobson | Achronix | Slides |
Firefly DirectConnect Options for ODSA Proof of Concept | Marc, Sam, Quinn, Bapi | N/A | Slides |
Design Tools for Chiplet-Based Design | Jawad Nasrullah | zGlue | Slides |
Business models | Sam Fuller/Jeff McGuire/Jim Finnegan | NXP/Kandou/Netronome | Slides |
Working w/ OCP, PoC JDA, Closing | Archna Haylock, Bill Carter | OCP | Slides |
Topic | Speaker | Video | Slides |
---|---|---|---|
Open Domain-Specific Architecture (ODSA) Sub-project Launch | Bapi Vinnakota (Netronome) | Video | Slides |
ODSA Workshop @ Netronome: January 29th, 2019