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Welcome to the OCP '''Thermal Sim Methodology''' workstream page | Welcome to the OCP '''Thermal Sim Methodology''' workstream page | ||
The Thermal Sim Methodology will | The Thermal Sim Methodology will standardize aspects of the thermal characterization of drives in systems, defining common methods, metrics, and assumptions. The goal of the methodology is to enable system and device vendors to better target new form factors such that the form factors meet the thermal requirements of the systems for which the form factors are being defined. | ||
==Links== | ==Links== | ||
Revision as of 23:17, 16 November 2020
WELCOME
Welcome to the OCP Thermal Sim Methodology workstream page
The Thermal Sim Methodology will standardize aspects of the thermal characterization of drives in systems, defining common methods, metrics, and assumptions. The goal of the methodology is to enable system and device vendors to better target new form factors such that the form factors meet the thermal requirements of the systems for which the form factors are being defined.
Links
Leads
- - Dave Landsman (Western Digital)
Documents
Important Note: Please do not submit confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. See OCP Policies. If you have any questions please contact OCP.
| Topic | Speaker | Company | Date Presented |
|---|---|---|---|
| Initial EDSFF Thermal | NGD Systems | 2020-10-28 | |
| E1.S Thermals Data | Dave Landsman & David Wright | Western Digital | 2019-10-28 |
| Datacenter SSD FF Thermal Issues | Jason Adrian | Microsoft | 2019-10-28 |
| E1.S Power Methodology | Brandon Gary | Microsoft | 2019-12-12 |
| EDSFF Thermal Methodology E1.S FF Width | Paul Gwin | Intel | 2020-01-16 |
| Thermal Workgroup Goals | Paul Gwin | Intel | 2020-02-13 |
| SSD Thermal Simulation Standardization for OCP Summit | Paul Gwin, Dave Landsman | Intel-Microsoft-WDC | 2020-05-14 |
| E3 Thermal Methodology Slides | Bill Lynn | DellEMC | 2020-07-09 |
| EDSFF Thermal Sim Spec Outline Doc v1 | Bill Lynn | DellEMC | 2020-07-23 |
| Thermal Methodology Revisit Discussion | Paul Gwin | Intel | 2020-07-30 |
Meetings
Meeting Information: Every Thursday at 3pm-4pm US Pacific Time, though Thursday, August-27
You can also dial in using your phone. United States: +1 (646) 749-3122
Access Code: 881-571-341
Recordings from Past Calls
- - november 5th, 2020
- - August 6th, 2020
- - July 30th, 2020
- - July 23rd, 2020
- - July 16th, 2020
- - June 25th, 2020
- - February 27th, 2020
- - February 20th, 2020
- - February 13th, 2020
- - February 6th, 2020