Server/NIC

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Welcome

Welcome to the OCP NIC subgroup under OCP Server Work Group. The goal of this subgroup is to form a healthy ecosystem in OCP NIC space, under OCP framework

Sub Project Lead

For more information, please contact Jia Ning (Facebook)


Guideline

We are here to build a supportive, informative and inclusive community:


Supportive

- Support implementation questions

- Evaluate new use cases

Informative

- Share the latest topics and trends related to OCP Mezz NIC spec

- Share both challenges and opportunities

Inclusive

- Take community feedback and make iterations to proposal before submitting major revision to work group and IC

- Open to both adopters, and observers

Get Involved

Updated Specification Docs

Doc Version Date Contributor Notes
OCP_NIC_3.0_rev_tracking_20190806 20190806 8/6/2019 OCP NIC subgroup This spreadsheet tracks the changes being discussed; Please follow this closely if you have design in pipeline.
OCP_NIC_3.0_draft_0v91_20190718b_TN_Release_no_CB 0v91 7/18/2019 OCP NIC subgroup 0v91 Specification(clean)
OCP_NIC_3.0_draft_0v91_20190718b_TN_Release_CB 0v91 7/18/2019 OCP NIC subgroup 0v91 Specification(with comment bar)
OCP 3.0 Pinout and PCIe Bifurcation 0v90_20190620a_TN_Release 20190620a 6/20/2019 OCP NIC subgroup Specification Support Doc: Pinout and PCIe Bifurcation table
MC MAC Address Provisioning Calculator 20190620a_TN_Release 20190620a 6/20/2019 OCP NIC subgroup Specification Support Doc: MC MAC Address Provisioning Calculator
OCP NIC 3.0 FRU - Intel Basic Example 20190620a_TN_Release.hex 20190620a 6/20/2019 Intel Specification Support Doc: FRU Example(HEX format)
OCP NIC 3.0 FRU - Intel Basic Example 20190620a_TN_Release 20190620a 6/20/2019 Intel Specification Support Doc: FRU Example(XLSX sheet)
OCP_NIC_3.0_thermal_models_0v80_20180604 0v80 6/4/2018 OCP NIC subgroup Thermal CFD model (Icepack) with Mechanical model (STEP) extracted
OCP_NIC_3.0_thermal_TestFixture_0v80_20180604 0v80 6/4/2018 Dell-EMC Thermal test fixture mechanical model(STEP) for small and large form factor NIC
OCP_NIC_3.0_thermal_TestFixture_BoardFiles_20190211 N/A 2/11/2019 Dell-EMC Thermal Test Fixture Electrical Board files (refreshed 2/11 to add gerber)
OCP_NIC_3.0_3D_CAD_0v91_20190729 0v91 7/29/2019 OCP NIC subgroup Mechanical 3D CAD models
OCP_NIC_3.0_Drawings_0v91_20190719 0v91 7/19/2019 OCP NIC Subgroup Mechanical 2D Drawings
OCP_NIC_3.0 Shock&Vibe Fixture_20190329 20190329 3/29/2019 Intel Mechanical Shock & Vibe test fixture design

Supporting docs and presentations

Doc Version Date Contributor Notes
OCP NIC community update Aug 2019_v02 N/A 8/7/2019 OCP NIC Subgroup OCP NIC Subgroup Aug'19 Monthly Update
OCP NIC community update July 2019 for ServerWG N/A 7/24/2019 OCP NIC Subgroup Presentation to Server WG July Monthly
OCP_NIC_3.0_discussion_r12_20180123 v12 1/23/2018 OCP NIC Subgroup Presentation to Server WG/IC
Mezz3.0 schedule v7_20180123 v7 1/23/2018 Facebook OCP NIC 3.0 spec project schedule
OCP NIC 3.0_Mechanical Discussion_v5_20171201_d v5 12/01/2017 Facebook Mechanical Deck


Thermal Deck_v7_20171115 v7 11/15/2017 Facebook Thermal deck
Updated thermal Simulation Results_v7_20171103 v7 11/3/2017 Facebook Thermal simulation result update


HPE_Comments_on_OCP_Mezz_v3_20170816 N/A 8/16/2017 HPE Presentation from HPE on 8/16/2017 call
Dell EMC - OCP NIC Presntation v1_20170906 v1 9/6/2017 Dell-EMC Presentation from Dell-EMC on 9/6/2017 call
Lenovo OCP Mezz3.0 Recommendations - 20170901 N/A 9/1/2017 Lenovo A mechanical focused presentation from Lenovo on 9/6/2017 call
9/25/2017 Workshop decks N/A 9/25/2017 Microsoft / TE / Amphenol / Broadcom / Intel / Facebook 9/25/2017 workshop slides from multiple contributors
9/25/2017 Workshop recording (large file 908MB) N/A 9/25/2017 Microsoft / TE / Amphenol / Broadcom / Intel / Facebook 9/25/2017 workshop recording from multiple contributors

0v70 Release Candidate Package

Specification Package Version Date Contributor Notes
OCP_NIC_3.0_draft_0v70_20180125c_TN_no_CB 0v70 1/25/2018 OCP NIC subgroup Specification without comment bar for Server WG and IC review
OCP_NIC_3.0_3D_CAD_0v70_20180122 0v70 1/22/2018 OCP NIC subgroup Mechanical 3D CAD models
OCP_NIC_3.0_2D_Drawings_0v70_20180124 0v70 1/24/2018 OCP NIC Subgroup Mechanical 2D Drawings
OCP_NIC_3.0_thermal_models_0v70_20180124 0v70 1/24/2018 OCP NIC Subgroup Thermal CFD model(PACK) with Mechanical model(STEP) extracted
OCP_NIC_3.0_thermal_TestFixture_0v70_20180124 0v70 1/24/2018 OCP NIC Subgroup Thermal test fixture mechanical model(STEP) for small form factor add-in-card


Updates

1/19/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v63_20180119e_TN


1/18/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v62_20180118f_TN


1/16/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v60_20180116e_TN


1/15/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v57_20180109c_TN


1/2/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v50_20171222i_TN

2. Move updates before 12/1/2017 to archive


12/20/2017 update

1. Updated spec draft, overview deck, and mechanical deck


12/5/2017 update

1. Update spec draft to OCP_NIC_3.0_draft_0v01_20171205c_TN

2. Update pin out to OCP 3.0 Pinout Proposal 20171205a_TN

3. Specification draft complete rate (Estimation)

Chapter Draft complete rate Status
1. Overview 70% drafted finishing up / under review
2. Card form factor 60+% drafted finishing up / under review
3. Card Edge and baseboard interface 80+ % drafted Under review
4. Management 0% drafted Need to work on
5. Data Network requirement TBD Same content as Mezz 2.0; check for need to keep this chapter
6. Card routing guideline and SI consideration TBD NC-SI specified on card; PCIe TBD
7. Thermal and Environmental TBD Need edit based on Mezz 2.0

4. Key mechanical updates:

- Agreed on guiding feature and card sizes

- Reduce to 2x sizes (Small and Large form factors; detail see latest spec draft)

To be closed:

- Front bracket / latching mechanism design for small and large form factors

- Right Angle connector vertical offset(3.05mm vs. 3.50mm); Need to decide and close based on Tolerance analysis

- Straddle Mount connector offset and PCB footprint; Need to decide and close based on 1U use case study


5. Coming working sessions and proposal of agenda:

-#7 12/6 : 2hr working session; ME and EE runs in parallel; close on ME opens and clarify the rest of draft work

-#8 12/13: 3-4hr: All draft work due for 1st pass of edit of all chapters. 1st cross review with changes suggested and agreed

-#9 12/20: 3-4hr: Review changes and post 1st draft



Find Archive of updates here

Archives prior to November 2018 Archives December 2018 - present

Meetings

This project meets - 1 times a Month; Defaults to 1st Wednesday of the Month.

Call-in info and source of truth @ http://opencompute.org/projects/projects-calendar/ (Time zone shown: Eastern Time)

This call is open to the public.

If there is a cancellation, we will try our best to cancel >24hrs before the meeting by the calendars above.

Meeting minutes is sent out in mailing list and can be found at archive

Recordings from Past Calls

- June 5th, 2019
- May 1st, 2019
- April 3rd, 2019
- March 6th, 2019
- January 2nd, 2019
- December 5th, 2018
- November 7th, 2018
- September 5th, 2018
- August 1st, 2018
- May 2nd, 2018
- April 18th, 2018
- April 4th, 2018

Events

2017/3/9

OCP Engineering Workshop Sessions https://ocpussummit2017.sched.com/event/9SAa/ocp-mezzanine-nic-20-and-beyond

More information about OCP events can be found at: http://www.opencompute.org/community/events/ocp-events-calendar


Communication

- Project communication is done through the https://ocp-all.groups.io/g/OCP-NIC.

- Please make sure following the steps until you receive 1) confirmation email from noreply@Groups.io 2) welcome email from OCP-NIC@OCP-All.groups.io.

Please check your junk box and unblock noreply@Groups.io & OCP-NIC@OCP-All.groups.io if you have trouble getting confirmation email.

- To access the mailing list archives go to: https://ocp-all.groups.io/g/OCP-NIC

- For general discussion, please use mailing-list above by default; This is public domain and all discussion is archived

- Reach to Jia Ning if there is strong reason not to have public discussion

Specifications and Designs

All these accepted by the IC

Specification Version Submit Date Contributor License Notes
OCP Mezzanine card v2.0

OCP_Mezz_2.0_rev1.00_20151215b_pub_release.pdf(2.2MB)

OCP_Mezz_2.0_rev1.00_20151215b_pub_release_3D_package.zip (88MB)

Mechanical 20151023_P1-P9_K1-K5 zip file (57MB)

V2.0-1.0 Dec 15, 2015 Facebook OWFa 1.0 Added support for x16 (quad x4), NCSI, dual QSFP+, & Quad SDP+

Accepted by OCP IC 2/24/2016

OCP Mezzanine card v0.5, original standard

Mezzanine Card (rev 0.5)

V0.5 Oct 8, 2012 Facebook OWFa 1.0 Defacto standard for the original network mezzanine with a x8 PCIe Gen3 interface
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