Storage/Thermal Sim Methodology
WELCOME
Welcome to the OCP Thermal Sim Methodology workstream page
The Thermal Sim Methodology will try to standardize aspects of the thermal characterization of drives and systems to enable drive and system designers to use common methods, metrics, and assumptions when designing for thermal targets required by end-users. The goal of the methodology is to enable both "apples-to-apples" comparison of drives in a system, and also to enable the ecosystem to better anticipate thermal requirements of new form factors being considered by the ecosystem.
Links
Leads
- - Dave Landsman (Western Digital)
Documents
Important Note: Please do not submit confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. See OCP Policies. If you have any questions please contact OCP.
| Topic | Speaker | Company | Date Presented |
|---|---|---|---|
| Thermal Workgroup Goals | Paul Gwin | Intel | 2020-02-13 |
| Initial EDSFF Thermal | NGD Systems | ||
| Intel-WDC-Microsoft - SSD Thermal Simulation Standardization | Paul Gwin, Dave Landsman | Intel, WDC | 2020-05-14 |
| E3 Thermal Methodology Slides | Bill Lynn | DellEMC | 2020-07-09 |
| EDSFF Thermal Sim Spec Outline Doc v1 | Bill Lynn | DellEMC | 2020-07-23 |
Meetings
Meeting Information: Every Thursday at 3pm-4pm US Pacific Time, though Thursday, August-27
You can also dial in using your phone. United States: +1 (646) 749-3122
Access Code: 881-571-341
Recordings from Past Calls
- - July 23rd, 2020
- - July 16th, 2020
- - June 25th, 2020
- - February 27th, 2020
- - February 20th, 2020
- - February 13th, 2020
- - February 6th, 2020