Storage/Thermal Sim Methodology

WELCOME

Welcome to the OCP Thermal Sim Methodology workstream page

The Thermal Sim Methodology will try to standardize aspects of the thermal characterization of drives and systems to enable drive and system designers to use common methods, metrics, and assumptions when designing for thermal targets required by end-users. The goal of the methodology is to enable both "apples-to-apples" comparison of drives in a system, and also to enable the ecosystem to better anticipate thermal requirements of new form factors being considered by the ecosystem.

Links

- Storage Project Mailing List

- OCP website

- OCP Calendar

Leads

- Dave Landsman (Western Digital)

Documents

Important Note: Please do not submit confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. See OCP Policies. If you have any questions please contact OCP.

- 20200116 - EDSFF Thermal Methodology E1,S FF Width (Intel)

- 20191212 - E1S_Power_Methodology (Brandon)

Thermal Sim Workstream Documents
Topic	Speaker	Company	Date Presented
E1.S Thermals Data - WDC	Dave Landsman & David Wright	Western Digital	2019-10-28
Datacenter SSD FF Thermal Issues - Microsoft	Jason Adrian	Microsoft	2019-10-28
E1.S Power Methodology - Microsoft	Brandon Gary	Microsoft	2019-12-12
Thermal Workgroup Goals	Paul Gwin	Intel	2020-02-13
Initial EDSFF Thermal		NGD Systems
Intel-WDC-Microsoft - SSD Thermal Simulation Standardization	Paul Gwin, Dave Landsman	Intel, WDC	2020-05-14
E3 Thermal Methodology Slides	Bill Lynn	DellEMC	2020-07-09
EDSFF Thermal Sim Spec Outline Doc v1	Bill Lynn	DellEMC	2020-07-23