Server/DC-MHS
Welcome
Welcome to the OCP DC-MHS Sub-Project.
DC-MHS R1 envisions interoperability between key elements of datacenter, edge and enterprise infrastructure by providing consistent interfaces and form factors among modular building blocks.
DC-MHS R1 standardizes a collection of HPM (Host Processor Modules) form-factors and supporting ingredients to allow interoperability of HPMs and platforms.
There are seven workstreams that comprise DC-MHS:
- M-FLW (FulL Width HPM)
- M-DNO (DeNsity Optimized HPM)
- M-XIO (eXtended I/O Connectivity)
- M-PIC (Platform Infrastructure Connectivity)
- M-CRPS (Common Redundant Power Supply)
- M-PESTI (PEripheral SideBand Tunneling Interface)
- M-SIF (Shared InFrastructure)
Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found on the OCP Policies page. If you have any questions please contact OCP.
Project Leadership
Sub-Project Leads
- Brian Aspnes (Intel)
- Shawn Dube (Dell)
Incubation Committee Representative
- Siamak Tavallaei (Google)
DC-MHS Wiki Administrator
- John Dinsmoor (Intel)
Current Status
DC-MHS R1 v1.0 specs have been approved by the OCP Incubation Committee in November 2022.
DC-MHS workstreams are working the DC-MHS R1 v1.1 specifications. Note: M-SIF is a workstream new to DC-MHS. M-SIF is working on v1.0 specification.
Latest Base Specifications
| Type | Description | Version | Submit Date | Contributor | License | Notes |
|---|---|---|---|---|---|---|
| Specification | DC-MHS v1.0 specifications: M-FLW_R1_v1p0 M-DNO_R1_v1p0 M-PESTI_R1_v1p0 M-PIC_R1_v1p0 M-XIO_R1_v1p0 M-CRPS_R1_v1p0 |
R1-v1.0_RC | 9/28/2022 | DC-MHS CLA group | OWF | Reviewed in Oct meeting. Approved by the IC on 11/4/2022
Final specifications are in the Contribution Database |
Active Documents
Documents and information on sub-groups are in the Wiki links above. Documents from the main Server group are below.
| Type | Description | Version | Submit Date | Contributor | License | Notes |
|---|---|---|---|---|---|---|
Get Involved
Meeting Schedule
For monthly public meetings:
- Schedule is TBD
- Each workstream has its own weekly meeting for companies that have signed the DC-MHS R1 CLA.
Recordings from Past Monthly Meeting Calls
- TBD
Slides from April 2022 OCP Tech Talks
| Presenters (Company) | Title | Video | Slides |
|---|---|---|---|
| Shawn Dube (Dell), Brian Aspnes (Intel) | DC-MHS Rev 1.0: Introduction and Overview (Datacenter - Modular Hardware System) | Video | Slides |
| Corey Hartman (Dell), Brian Aspnes (Intel) | DC-MHS: FulL Width HPMs (M-FLW) | Video | Slides |
| Mike Gregoire (Dell), Dirk Blevins (Intel) | DC-MHS: DeNsity Optimized HPMs (M-DNO) | Video | Slides |
| Cliff DuBay (Intel), Tim Lambert (Dell) | DC-MHS: Peripheral Infrastructure Connectivity (M-PIC) | Video | Slides |
| Charlie Ziegler (Dell), Javier Lasa (Intel) | DC-MHS: eXtensible I/O (M-XIO) | Video | Slides |
| Tim Lambert (Dell), Javier Lasa (Intel) | DC-MHS: PEripheral Sideband Tunneling Interface (M-PESTI) | Video | Slides |
| Aurelio Rodriguez (Intel), Jon Lewis (Dell) | DC-MHS: Common Redundant Power Supply (M-CRPS) | Video | Slides |
Slides/Recordings from October 2022 OCP Global Summit
| Presenter | Title | Video | Slides |
|---|---|---|---|
| Aurelio Rodriguez Echevarria (Intel Corporation) | Corey Hartman (Dell) | Tim Lambert (Dell Inc.) | Eduardo Estrada (Intel Corporation) | PANEL: DC-MHS R1 report-out and timeline | Video | Slides |
| Brian Aspnes (Intel Corporation) | Shawn Dube (Dell) | Jean-Marie Verdun (HPE) | Dharmesh Jani (Meta) | PANEL: Datacenter Modular Hardware System (DC-MHS) | Video | Slides |
| Todd Westhauser (Meta) | Vincent Nguyen (HPE) | Practical Usage of DC-MHS M-DNO Concepts | Video | Slides |
| Dirk Blevins (Intel Corporation) | Multi-host Modular Systems | Video | Slides |
OCP Marketplace Entries
The most recent documents will always be in the OCP Marketplace, Specifications & Design Collateral
or the OCP Marketplace, Orderable Products
Entries below are for ease of use and historical reference. Please use the marketplace links for the most recent documents.
| Type | Description | Version | Submit Date | Contributor | License | Notes |
|---|---|---|---|---|---|---|