Storage/Thermal Sim Methodology

WELCOME

• Welcome to the OCP Thermal Sim Methodology Workstream.

Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found on the OCP OCP Policies page. If you have any questions please contact OCP.

Get Involved

- Storage Project Mailing List

- OCP website

- OCP Calendar

Project Leadership

Project Leads

- Jason Adrian (Microsoft)

- Dave Landsman (Western Digital)

Meetings

Meeting Information: Every Thursday at 3pm Pacific Time

• Call Link

You can also dial in using your phone. United States: +1 (646) 749-3122

Access Code: 881-571-341

Recordings from Past Calls

- Tape Durability Modeling Workstream: February 26th, 2019

- Tape Durability Modeling Workstream: February 12th, 2019

- Tape Durability Modeling Workstream: January 8th, 2019

- Tape Durability Modeling Workstream: December 18th, 2018

- Tape Durability Modeling Workstream: December 4th, 2018

- Archival Storage Kickoff call: September 4th, 2018