Hardware Management/Hardware Management Module

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Welcome[edit]

Welcome to the OCP Hardware Management Module Sub-project. This is a sub-project of the OCP Hardware Management Project
This Project is open to the public and we welcome all those who would like to be involved.
Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found on the OCP OCP Policies page. If you have any questions please contact OCP.

Charter[edit]

This Subproject creates designs and specifications to enable interoperable hardware for platform manageability, in the form of System on a Module (SOM) designs. Deliverables from this project will include:

  • Specification for the interface between the System on a Module and the underlying platform
  • Design guides for platform designers wanting to use the module
  • Designs for reference modules and carrier cards

Presentation Template[edit]

- OCP Presentation Template - please contact Michael Schill or Archna Haylock for a copy

Project Overview[edit]

The management controller module separates the common platform management hardware and places them behind a connector. the module is specified by its connector pin-out The module may have one or more form-factors

Sub-Project Leadership[edit]

- Eric Shobe (Dropbox)
- Qian Wang (Intel)
- Mailing List

Active Documents and Specs[edit]

Documents and information collateral are in the Wiki links above. Documents from the main HW Management Module group are below.

Type Description Revision Submit Date Contributor License Notes
Specification OCP DC-SCM Rev2.0 ver1.0 specification candidate


OCP DC-SCI Rev2.0 ver1.0 candidate

OCP DC-SCM Rev2.0 Security Considerations candidate

OCP LTPI specification ver1.0 specification candidate

OCP DC-SCM Rev2.0 mechanical files candidate

2.0 July 27, 2022 Advanced Micro Devices; AMI US Holdings Inc.; Ampere Computing; Arm, Ltd.; ASPEED Technology, Inc.; Dell, Inc.; GOOGLE LLC; Hewlett Packard Enterprise; IBM Corporation; Inspur Electronical Information Industry Co., Ltd.; Intel Corporation; Lattice Semiconductor Corporation; Lenovo, ISG; Microsoft Corporation; MiTAC Computing Technology Corporation; Oracle Americas, Inc. Modified OWFa 1.0 CLA (modified 07/2021) last updated July 2022
Approved by IC
Specification OCP DC-SCM Rev 1.0_release_to_OCP.pdf


OCP DC-SCM spec Rev 0.95_release_to_OCP.pdf

OCP DC-SCM spec Rev 0.8_release_to_OCP.pdf

1.0 3/26/2021


12/02/2020

11/10/2020

Microsoft & Google OWFa 1.0 CLA 05/26/2021
* approved by IC, available on the contributions portal

03/26/2021
* For submitting into the contribution database
12/02/2020
* For review in November IC calls
11/11/2020
* For review in November Server and HW-MGMT project calls

Specification RunBMC v1.5 WIP pinout n/a 1/24/2020 Dropbox n/a n/a

Accepted & Inspired submissions, available in the Marketplace[edit]

The most recent documents will always be in the OCP Marketplace, Specifications & Design Collateral or the OCP Marketplace, Orderable Products

Entries below are for ease of use and historical reference. Please use the marketplace links for the most recent documents.

Type Description Version Submit Date Contributor License Notes
Specification RunBMC DaughterBoard I/O Specification 1.4.1 Final 08/15/2020 Dropbox & Salesforce OWFa 1.0 CLA Approved
Product + Design Pkg RunBMC ASPEED AST2500 32mm card following RunBMC 1.4.1 Specification

RunBMC AST2500 OpenBMC Repo
RunBMC AST200 Design Package and Quick Start Guide

v1.0 08/15/2020 Hyve OWFa 1.0 Marketplace Product Link

DC-SCM 2.0 Workgroup[edit]

Meetings


This workgroup currently meets on the first Monday of each Month.

Call-in info and source of truth @ http://opencompute.org/projects/projects-calendar/ (Time zone shown: Eastern Time)

This call is open to the public.

If there is a cancellation, we will try our best to cancel >24hrs before the meeting by the calendars above.

DC-SCM2.0 meeting agenda and minutes

Opens tracking

This is a live document, used to track and communicate open topics and feedbacks for the DC-SCM 2.0 specification This document contains pin definition revisions for the DC-SCM 2.0

DC-SCM Rev 2.0 Opens tracking sheet

Presentations

Design specification proposal

OCP summit 2020 Intel Cyclone V-based RunBMC solution.pptx

OCP summit 2020Intel Cyclone V-based RunBMC solution video

DC-SCM2 -- System Usage Examples -- 2021-02-01

DC-SCM2 -- OpenFSI proposal -- 2021-03-25

DC-SCM2 -- OpenFSI proposal -- 2021-05-31

MCSI Electrical IO Specification Proposal 4-15-2021.pdf

OCP summit 2021 DC-Stack Overview Executive Talk

OCP summit 2021 DC-Stack Overview Expo Hall Talk

OCP summit 2021 DC-Stack Software

OCP summit 2021 DC-MHS

OCP summit 2021 DC-XPI

OCP summit 2021 DC-SCM 2.0 update

OCP summit 2021 DC-SCM 1.0 update

OCP summit 2019 DC-SCM concept introduction

OCP Regional summit 2019: DC-SCM progress report

OCP Regional summit 2019: DC-SCM for OAI

2021 OCP Global Summit: Introduction of DC-SCM 2.0 LVDS Tunneling Protocol & Interface (LTPI)

2021 OCP Global Summit: Intel CycloneV RunBMC v2 Demo

2021 OCP Global Summit: Intel DC SCM 2.0 Prototype Demo

2021 OCP Global Summit: Intel DC SCM 2 0 LTPI Demo

Get Involved[edit]

Participate in the discussion, mailing list: Mailing List Info
Participate in HW Management Module sub-project meetings
- OCP Calendar


Past Call Recordings[edit]

- DC-SCM2.0 May 2nd, 2022
- DC-SCM2.0 April 4, 2022
- DC-SCM2.0 March 7, 2022
- DC-SCM2.0 Feb 7, 2022
- DC-SCM2.0 Dec 6, 2021
- October 4th, 2021
- June 7th, 2021
- May 10th, 2021
- May 3rd, 2021
- April 26th, 2021
- April 19th, 2021
- April 12th, 2021
- April 5th, 2021
- March 29th, 2021
- March 15th, 2021
- March 8th, 2021
- March 1st, 2021
- February 22nd, 2021
- February 8th, 2021
- February 1st, 2021
- January 25th, 2021