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• IC Members
  * John Leung (Intel) - Hardware Management
  515 bytes (72 words) - 11:07, 17 October 2022
• Networking/MonthlyCalls/2014-09-08
  * John Linville (Red Hat) * John-Nicholas Furst (Akamai)
  2 KB (367 words) - 13:35, 13 October 2014
• Cooling Environments/ACF Advanced Cooling Facilities
  ...Gross] (J. M. Gross Engineering, LLC), [mailto:john.menoche@ocproject.net John Menoche] (Vertiv) ...Download a copy and email to [mailto:John.gross@ocproject.net John Gross]. John Menoche will not receive these files due to a commercial conflict, as Verti
  10 KB (1,685 words) - 23:07, 2 December 2022
• Cooling Environments Advanced Cooling Solutions
  :- Door Heat Exchange Workstream [mailto:john.fernandes@ocproject.net John Fernandes] (Facebook) :- Immersion Cooling Workstream [mailto:john.bean@ocproject.net John Bean] (GRC)
  6 KB (930 words) - 20:19, 25 April 2022
• Server/GP Enterprise
  :- [mailto:john.stuewe@ocproject.net John Stuewe] (Dell)
  2 KB (279 words) - 16:59, 2 June 2021
• Storage Project Special Elections
  John Dickson has announced his resignation as the Storage project lead. We are Many thanks to John Dickinson for all his hard work on the OCP storage project and good luck to
  3 KB (560 words) - 18:17, 16 October 2013
• Networking/MonthlyCalls/2014-11-10
  * John-Nicholas Furst (Akamai) * John Jones (EZchip) - prefer Dec 9
  4 KB (584 words) - 00:34, 14 November 2014
• OCP C&I Q2-2013
  ::[ ] Identify target institutions for RFI - '''Paul Rad, John Kenevey'''
  2 KB (296 words) - 06:19, 17 July 2013
• Summit/US15
  *Keynote: Hewlett-Packard - Alain Andreoli, Senior VP, John Gromala, Senior Director, Antonio Neri Senior VP - [https://www.youtube.com
  7 KB (1,035 words) - 22:52, 5 May 2015
• Server/Archive
  Presented by John Leung in 8/23/17 workgroup meeting Presented by John Leung in 8/23/17 workgroup meeting
  10 KB (1,602 words) - 16:11, 23 September 2021
• Cooling Environments/Door Heat Exchanger
  :- Door Heat Exchanger Workstream [mailto:john.fernandes@ocproject.net John Fernandes (Facebook)
  7 KB (1,092 words) - 05:17, 7 February 2023
• Hardware Management
  :- [mailto:john.leung@ocproject.net John Leung] (Intel)
  8 KB (1,223 words) - 22:40, 27 February 2023
• Telcos/Edge
  :- [mailto:john.kaczala@ocproject.net John Kaczala] (Nokia)
  10 KB (1,653 words) - 17:16, 9 February 2023
• Hardware Management/SpecsAndDesigns
  ...38.pdf OCP Profiles for Hardware Management] - presented by Hemal Shah and John Leung, OCP Global Summit 2019.
  6 KB (979 words) - 20:08, 15 August 2022
• Cooling Environments/Immersion
  :[mailto:john.bean@ocproject.net - John Bean] (GRC) [mailto:John.Bean@ocproject.net - John Bean] (GRC)
  28 KB (4,061 words) - 21:04, 1 February 2023
• Server
  :- [mailto:john.stuewe@ocproject.net John Stuewe] (Dell), [mailto:marka.shaw@ocproject.net Mark A Shaw] (Microsoft)
  11 KB (1,635 words) - 02:20, 7 February 2023
• HPC
  | John Fernandez, Cheng Chen
  19 KB (3,097 words) - 23:28, 21 February 2023
• OCP Incubation Committee Strategy Wiki
  * [mailto:john.leung@ocproject.net John Leung] (Lead)
  20 KB (3,175 words) - 20:06, 13 January 2023
• Storage Presentations
  | Riyan Mendonsa & John Dykes
  13 KB (1,976 words) - 22:21, 15 February 2019
• Server/ODSA
  ...lides - Mixing Open Source and Embedded Ecosystem IP for the future of HPC John Shalf, Department Head for Computer Science, Lawrence Berkeley National Lab ...Design Methodologies for Next-Gen Multi-Chip(let) Packaging Presentation - John Park, Cadence] [http://files.opencompute.org/oc/public.php?service=files&t=
  48 KB (7,866 words) - 00:15, 7 February 2023